Mirafra Technologies will be participating in DAC 2024, San Francisco from June 23-27. Click here to setup a time with our team at DAC 2024

Mirafra Technologies will be participating in DAC 2024, San Francisco from June 23-27. Click here to setup a time with our team at DAC 2024

Mirafra Software Technologies Pvt. Ltd

Unleashing the power of semiconductor solutions

Innovative solutions tailored to your unique needs
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Embracing technological evolution in BFSI

Mirafra Software Technologies is a global technology solutions company dedicated to providing innovative workforce services for the Banking, Financial Services, and Insurance (BFSI) domain. Our tailored solutions address the dynamic needs of BFSI organizations, offering a spectrum of services to enhance operational efficiency and drive innovation.

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AI-driven design and beyond

Pioneering the next era of semiconductors

In this ever-evolving landscape, we lead the charge with cutting-edge solutions spanning the entire semiconductor spectrum. From Domain-Specific Architecture to Open Source Architectures, and from chiplet architecture & multi-die integration to advanced packaging, our offerings seamlessly align with the dynamic needs of the industry. What sets us apart is our unwavering commitment to AI-driven design, positioning us as visionary pioneers shaping the future of semiconductor technology. As technology continues its rapid advancement, our dedication to innovation remains steadfast. We are committed to meeting the burgeoning demand and harnessing the transformative power of semiconductors in our interconnected world.

Key drivers of Semiconductor growth

Growing need / significance of semiconductor industry

From dawn's first light to the twilight hours, semiconductors quietly power every facet of our lives. Embedded within electronic devices, they drive progress in communications, computing, healthcare, transportation, and clean energy. Their subtle influence lies in their ability to optimize efficiency and connectivity, from consumer gadgets to industrial machinery. As technological advancements accelerate, semiconductors remain the sophisticated backbone of modern innovation, indispensable in shaping our interconnected world.

Market size and trends

The semiconductor industry is on track to reach a staggering $1 trillion valuation by 2030, highlighting its pivotal role in driving progress across various sectors. With the global semiconductor market valued at around USD 607 billion in 2022 and projected to grow at a robust Compound Annual Growth Rate (CAGR) of 7 to 9 percent, the industry's significance is underscored by its substantial impact on key sectors such as automotive, computation and data storage, and wireless technologies.

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Our services

At Mirafra Software Technologies, our ambition is to emerge as the trusted companion for semiconductor firms, delivering top-notch solutions while capitalizing on our extensive domain expertise.

Transforming ideas into reality — End-to-end semiconductor expertise

Multi-die solutions

Capitalizing on the multi-die trend, our skilled engineers drive the development of integrated circuits combining multiple semiconductor dies. This enhances performance, cuts power usage, and enables more compact devices.

Domain-specific architecture

In the hardware-focused landscape, domain-specific architectures (DSAs) offer tailored solutions with enhanced performance and efficiency. With around 150 startups prioritizing hardware innovations in the last decade, we remain dedicated to innovation and client success amidst this transition.

Open-source architecture

Hennessy and Patterson, in their 2018 Turing Lecture, endorsed open architectures like RISC-V for innovation and cost savings. These Open Instruction Set Architectures (ISAs) offer flexibility, simplicity, and lower power consumption, fostering more secure designs. Presently, our team is actively customizing an open-source processor for our specific requirements.

Chiplets

We prioritize chiplet architecture, supporting client projects through our offshore development centers or on-site engineers. Our goal is to drive the modularization of semiconductor designs, fostering flexibility and scalability while optimizing resource utilization and promoting efficiency through die-to-die interconnects and advanced packaging technologies like 3D integration.

AI-driven design — Hardware is a differentiator in design

The computing landscape is transitioning to domain-specific accelerators (DSAs) and application-specific integrated circuits (ASICs) from traditional CPUs and GPUs, while advancements in memory and storage technologies like High Bandwidth Memory (HBM), larger on-chip memory, and Non-Volatile Memory (NVM) offer semiconductor companies a historic opportunity for growth and technological leadership.

Analog in-memory computing

Our company actively pioneers in-memory computing, revolutionizing traditional processor-memory separation by processing computations directly within the memory fabric, resulting in significant power and time savings, and offering collaborative engagements with clients worldwide to drive advancements in this transformative technology.

Packaging

Our company specializes in semiconductor packaging solutions, offering a comprehensive range of techniques including traditional single-chip and multi-chip packaging, advanced options like System-in-Package (SiP) and 3D packaging, and ongoing advancements in materials and integration technologies, all led by skilled engineers dedicated to enhancing thermal management, reducing form factors, and ensuring overall system reliability for our clients' projects.

Evolving communication technologies

The imminent rollout of 6G networks, coupled with advancements in WiFi and Bluetooth specifications, is set to profoundly impact the semiconductor industry, fueling demand for advanced chips, driving innovation, and reshaping global economic landscapes.

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Why choose us?

Your partner in progress – driving technological advancements with our semiconductor solutions

What sets us apart

Our active involvement in multi-die solutions, domain-specific architecture, and open-source architectures demonstrates our commitment to staying ahead of industry trends.

Our experienced engineers possess the technical expertise to drive development in various specialized areas, such as chiplets, AI-driven design, analog in-memory computing, and advanced packaging.

We offer flexible collaboration options, including working from offshore development centers or directly at the client’s office, ensuring seamless project integration and delivery.

Our dedication to innovation, as seen in our engagement with emerging technologies like multi-die solutions and analog in-memory computing, underscores our commitment to driving technological advancements.

We are actively involved in addressing evolving communication technologies, such as the advent of 6G networks, WiFi, and Bluetooth advancements, highlighting our role in shaping the future of the semiconductor industry.

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