Mirafra Technologies | Top ASIC VLSI SOC Semiconductor Design Services Company | RTL Design, Verification, UVM, Gate Level Simulation, STA, Physical Design, Signoff, Analog Layout, Embedded Software, Enterprise Application, IOT, M2M, Data Analytics, Mobile, Networking, Automotive, Storage, Communications, Infotainment, Linux, Android, RTOS, Kernel, BSP, Porting, Device, Driver, Automotive, Embedded, IoT, Cloud, Analytics, Bigdata, Testing, Networking, Storage, Service

Physical Design, Signoff & PV

Expertise in place & route for block build/full chip development with timing closure using industry standard tools for tasks like Synthesis, Floor Plan, Placement, CTS, Signal Integrity, IR Draw, EM, Low Power Checks and Signoff checks. Extensive Knowledge in physical verification like DRC, LVS, Antenna, Density in latest nodes like 14nm, 10nm. Experience in DFT Techniques like Scan, Bist, ATPG, Boundary Scan.


At Mirafra Technologies, Physical Design Service offerings are comprised of having expertise in following domains
Hierarchical/Flat level chip implementation
Core Hardening or block Build development
Die Size optimization and related scripting and automation support
Physical Verification/DFM support for Hard Macros and full chip level
Signoff timing closure with X-talk effects, OCVs and ECO’s implementation
Low Power Implementation for Static/Dynamic reductions
Synthesis/Formal equivalence/UPF flow/CLP checks support
Extensive support on DFT insertion and Simulations
EDA/CAD flow & methodology support
Our philosophy is to become a dedicated service partner to our esteemed clients in all the above niche skills requirements on multiple projects and earn the most trusted design service partner. Our engineers are agile and possess the quality of quickly adapt the new flows and methodology to deliver quality results.

Design Implementation

Library and Flow Development

IC Packaging Co Design